Summary

Engineering, semiconductors, flip chip, bumping, packaging, test, PCB, hardware, Quality, reliability, burn-in

Description

Manufacturer of Semiconductors wafers and die, along with Engineering services and tools. Services include PCB Assembly/Layout Wafer and die bumping Advanced packaging assembly Semiconductor Components

Special details

Wire Bonding Design and development tools Finetech placement tool Wafer fabrication (bumping) Clean room

Profile

  • Incorporated in
    Texas
  • Established since
    2001
  • Main/Branch
    Branch

Address

Contact