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FIRST LEVEL INC.

Summary

Electronic, Manufacturing, Services, SubContract, Semiconductor, Packaging, Manufacturer, Optoelectronic, Medical, Assembly, COB, Chipscale, Packages, Modules, Wirebond. Diebond, CircuitBoard, PCB, Component, Encapsulation, Multichip, Hybrid, LeadAttach, Studbumping, Micropost

Industry

Profile

Incorporate State: Pennsylvania | Since: | Main/Branch: Branch | Profile views: 2

Address

State: Pennsylvania | County: York | City: York | Address: 3109 ESPRESSO WAY | ZIP Code: 17406-6040 | Map URL: 3109 ESPRESSO WAY YORK PA 17406-6040

Description

Microelectronic Packaging Precision Component Placement Die Attach Wire Bond-wedge and ball Circuit Board Design and Assembly Stud Bumping Encapsulation Hermetic Lid Sealing Lead Attach Package Design and Assembly

Contact

Phone: 717-266-2450 | Fax: 717-266-7410 | Email: [email protected] | Website: http://www.firstlevelinc.com

Special Details

Wire bonding Pick and Place Die Bonding Encapsulation Assembly tools

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