FIRST LEVEL INC.

Pennsylvania

Branch

Summary

Electronic, Manufacturing, Services, SubContract, Semiconductor, Packaging, Manufacturer, Optoelectronic, Medical, Assembly, COB, Chipscale, Packages, Modules, Wirebond. Diebond, CircuitBoard, PCB, Component, Encapsulation, Multichip, Hybrid, LeadAttach, Studbumping, Micropost

Industry

Manufacturing

Profile

Incorporate State: Pennsylvania | Since: 2000 | Main/Branch: Branch | Profile views: 2

Address

Classification

Semiconductor and Related Device Manufacturing | Printed Circuit Assembly (Electronic Assembly) Manufacturing | Other Electronic Component Manufacturing

Description

Microelectronic Packaging Precision Component Placement Die Attach Wire Bond-wedge and ball Circuit Board Design and Assembly Stud Bumping Encapsulation Hermetic Lid Sealing Lead Attach Package Design and Assembly

Contact

Phone: 717-266-2450 | Fax: 717-266-7410 | Email: [email protected] | Website: http://www.firstlevelinc.com

Special Details

Wire bonding Pick and Place Die Bonding Encapsulation Assembly tools

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