Summary
Die Extraction, DER, Die Extraction and Reassembly, Die Extraction Assembly and ENEPIG die pad plating, DEER, Obsolescence Solutions, High Temperature Solutions, Integrated Circuits, IC, IC Manufacturing and Assembly, Engineering Solutions, Reverse Engineering, Electronic Component Manufacturer
Classification
- Metal Coating, Engraving (except Jewelry and Silverware), and Allied Services to Manufacturers
- Electroplating, Plating, Polishing, Anodizing, and Coloring
- Bare Printed Circuit Board Manufacturing
- Semiconductor and Related Device Manufacturing
- Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Other Electronic Component Manufacturing
- Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Description
GCI designs, develops, and manufactures form, fit, and function drop-in replacement electronics that can be seamlessly integrated into a larger electronics system as required. The replacement electronic components work identically to the original obsolete components. Commercial Off The Shelf (COTS) electronics fail to meet reliability requirements in certain demanding environments. GCI has the ability to repackage any die from a plastic package into a hermetic ceramic package as originally required. Hermetic packaging provides superior reliability to plastic packaging of integrated circuits (IC) and are able to meet full military standard qualification requirements.
Profile
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Incorporated in
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Established since2006
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Main/BranchBranch
Address
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State
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County
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City
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Address4815 LIST DR
STE 109 -
ZIP Code80919-3312
Contact
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Phone
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Fax
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Email
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Website
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Contact PersonDustin Morgan