Summary

Grinding, dicing, semiconductortapes

Industry

Description

GDSI provides wafer grinding and dicing to large and small integrated circuit manufacturers as well as fabless companies. GDSIs service offerings include backgrinding, dicing and saw, pick and place, automated inspection, and wafer polishing.

Profile

  • Incorporated in
    California
  • Established since
    1992
  • Main/Branch
    Branch

Address

Contact