Summary

Electronic Packaging, microchip, wireless, heterogeneous, integration, insertion loss, semiconductor, microfabrication, nanofabrication, Quilt Packaging, microelectronics, packaging, multichip module, system in package, ultra high bandwidth, chip scale package, chip stacking, TSV, through silicon via, quad flat pack, 3D integration

Description

Indiana Integrated Circuits, LLC (“IIC”) develops next-generation, “More Than Moore” semiconductor integration strategies and processes which enable game-changing cost and performance improvements for tomorrow’s electronic systems.

Special details

In addition to providing expertise and licensing related to interconnect solutions, IIC has access to microelectronic fabrication equipment and cleanroom facilities for proof-ofconcept studies, process development work, and low-volume production.

Profile

  • Incorporated in
    Indiana
  • Established since
    2009
  • Main/Branch
    Branch

Address

Contact