Summary

Semiconductor, Electronic, Component, Assembly, testing, wafer, thinning, sawing, inspection.

Industry

Description

Semiconductor component assembly and testing services. Includes wafer thinning, sawing and inspection as well wire bond and flip chip heremetic and non-hermetic assembly.

Profile

  • Incorporated in
    California
  • Established since
    1990
  • Main/Branch
    Branch

Address

Contact