Summary

Development, R&D, Research, wet process, waveetch, wave etch, single sided, thinning, thin, substrate, stress, relief, grinding, CMP, semiconductor, wafer

Description

Materials and Technologies Corp. provides advanced process development and single sided cassette-to-cassette WaveEtch wet processing systems to thin, etch, develop, and rinse automatically a substrate?s single side. Thinning can be done down to 50 um.

Special details

MATECH's systems are in place in leading fabs and account for significant improvements in yield, efficiency or environmental impact. Our WaveEtch systems wet process in a precise and automated manner using a fraction of chemicals used by other processes

Profile

  • Incorporated in
    Delaware
  • Established since
    1992
  • Main/Branch
    Branch

Address

Contact