MATERIALS & TECHNOLOGIES CORP

MATERIALS & TECHNOLOGIES CORP

New York

Branch

Summary

Development, R&D, Research, wet process, waveetch, wave etch, single sided, thinning, thin, substrate, stress, relief, grinding, CMP, semiconductor, wafer

Industry

Manufacturing | Professional, Scientific, and Technical Services

Profile

Incorporate State: Delaware | Since: 1992 | Main/Branch: Branch | Profile views: 4

Address

Classification

Semiconductor Machinery Manufacturing | Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables | Engineering Services | Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

Description

Materials and Technologies Corp. provides advanced process development and single sided cassette-to-cassette WaveEtch wet processing systems to thin, etch, develop, and rinse automatically a substrate?s single side. Thinning can be done down to 50 um.

Contact

Phone: 845-463-2799 | Fax: 845-463-2786 | Email: [email protected] | Website: http://www.matech.com

Special Details

MATECH's systems are in place in leading fabs and account for significant improvements in yield, efficiency or environmental impact. Our WaveEtch systems wet process in a precise and automated manner using a fraction of chemicals used by other processes