Summary

IC Packaging, Microelectronics, optoelectronics, outsource

Industry

Description

Microelectronics Assembly Technologies and Speciality Chip Packaging outsourcing. Broad capabilities of optoelectronics assembly and test, flip chip, COB, SMT and IC Packaging. Facilities include 2,200 sq. ft. of Class 1000 clean room.

Profile

  • Incorporated in
    California
  • Established since
    1994
  • Main/Branch
    Branch

Address

Contact