SAWSTREET LLC
State:
Florida
Branch Location:
Branch
Summary
Wafer Processing, Wafer Dicing, Pick and Place, Dicing Wafers, Quick Turn, Wafer Grinding, Die Pick and Place, Backend Services, GaAs Wafer Process, Reticle Dicing, Quick Turn Process, Si Wafer Processing, Wafer Thinning, Die Inspection
Industry
Profile
Address
State: Florida | County: Orange | City: Orlando | Address: 6450 KINGSPOINTE PKWY
STE 6 | ZIP Code: 32819-6508 | Map URL: 6450 KINGSPOINTE PKWY STE 6 ORLANDO FL 32819-6508
STE 6 | ZIP Code: 32819-6508 | Map URL: 6450 KINGSPOINTE PKWY STE 6 ORLANDO FL 32819-6508
Classification
Description
SawStreet provides backend services that include Grinding, Polishing, Dicing, Pick & Place, and Inspection. SawStreet handless low to mid volume, specializing in quick turn requirements. Additional services include managing IC packaging and bumping
Contact
Phone: 407-601-4907 | Fax: 407-544-0928 | Email: [email protected] | Website: http://www.sawstreet.com
Special Details
SawStreet operates out of a class 100 clean room with automated equipment (ie. Dicing Saw, Pick and Place). Owners have been in working in the electronics business for a combined total of 40 years plus.
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