Summary

BGA, CZ, Carbon Fiber, Carbon Powder, Dicing, Double Sided, EPI, FZ, Gallium Arsenide, Germanium, IC Shipping Trays, Lapping, MQFP, PGA, Patterned, Polishing, Prime Wafers, Reclaimed, Silicon Carbide, Silicon Wafers, TQFP, TSOP I, TSOP II, Thermal Oxide, Wafers

Industry

Description

Silicon Wafers and Wafer Processing.

Profile

  • Incorporated in
    California
  • Established since
    1990
  • Main/Branch
    Branch

Address

Contact