Summary

Biotechnology Sensors, Optical Sensors, Semiconductor, Silicon wafers, Glass wafers, Quartz Wafers, AlN Substrates, Alumina wafers, Prototype, Wire Bonding, Wirebonding, Wafer Dicing, dicing, wafers, assembly, electronic assembly, Prototype wafer patterning and coating, Aluminum Nitride Patterning and Machining, Aluminum Oxide Alumina Al2O3, Sapphire

Industry

Description

Dicing and Assembly services from prototype to medium volume from design to final product including wire bonding and front end wafer processing.

Special details

Disco Dicing Saws, Westbond Automatic Wire Bonder, K&S Wire Bonder, Nano 3 User, Silicon, Glass, Fused Silica, Quartz, Aluminum Oxide, Aluminum Nitride, Sapphire

Profile

  • Incorporated in
    California
  • Established since
    2003
  • Main/Branch
    Branch

Address

Contact