Summary

Semiconductor Packages, Interposers, System in Package, Multi Chip Modules, SIP, Flip Chip and BGA Packages, 15um geometries, 12 Layer 'Build Ups', Ultra Thin Laminates, 'Quick Turn' Responses

Industry

Description

Manufacturer of Semiconductor Packages and High Density Interconnects, Flip Chip, BGA,SIPS,MCMLs and Fine Line Interposers. 'Quick Turn' fabrications are a specialty.

Special details

ITAR Registered Wide array of high perfomance laminates always in stock. Laser Vias @ 50ums Circuit geometies capable to 12um L/S

Profile

  • Incorporated in
    California
  • Established since
    1994
  • Main/Branch
    Branch

Address

Contact