Summary

Blind Via, Burried Via, Double Sided, Heatsink, Multilayer, Printed Circuit, SIPAD, Single Sided, Thermagon, Flex circuits, rigid-flex circuits

Industry

Description

MFG OF HI RELIABILITY D/S, MULTILAYER, FLEX AND RIGID FLEX PRINTED CIRCUIT PRODUCTS. SPECIALIZING IN PROTO-TYPE TO MEDIUM RUN QUANTITIES. WE OFFER VALUE ADDED SIPAD SOLID SOLDER DEPOSITION PROCESS AND THERMAL MANAGEMENT PRODUCTS. MIL-SPEC CERTIFIED, ISO-9001, UL APPROVED.

Special details

Specialists in Heat Sinks, Metal cores and Thermal Management. Solid Solder Deposit Technology. CERAMIC PLATING

Profile

  • Incorporated in
    Illinois
  • Established since
    1984
  • Main/Branch
    Branch

Address

Contact