Summary

BALL, BGA, BOARD, BURN, BURN-IN, CIRCUIT, CONNECTOR, CONNECTORS, CSP, ELECTRICAL, HYBRID, IN, LGA, MOUNT, OPTICAL, PACKAGE, PCB, PRINTED, QFN, SEMICONDUCTOR, SOCKET, SOCKETS, SURFACE, SYSTEM, TEST

Industry

Description

SOCKETS & CONNECTORS FOR BURN-IN, TEST & CUSTOM APPLICATIONS; PRINTED CIRCUIT BOARD ASSEMBLIES FOR TEST & BURN-IN; BURN-IN, HUMIDITY & TEMPERATURE-HUMIDITY-BIAS SYSTEMS & THERMOCYCLING SYSTEMS FOR SEMICONDUCTOR COMPONENTS.

Special details

SOCKET AND PRINTED CIRUCIT BOARD MATERIALS UP TO 300 C. SOCKETS FOR BGA, CSP, LGA, QFN, OPTICAL, PGA, POWER DEVICES, CUSTOM HYBRID, MICROWAVE, FLAT PACK AND HIGH FREQUENCY ELECTRONIC PACKAGING. SOME SURFACE MOUNT SOCKETS FOR MAINTENANCE EASE.

Profile

  • Incorporated in
    Pennsylvania
  • Established since
    1983
  • Main/Branch
    Branch

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