Summary

Die Extraction, DER, Die Extraction and Reassembly, Die Extraction Assembly and ENEPIG die pad plating, DEER, Obsolescence Solutions, High Temperature Solutions, Integrated Circuits, IC, IC Manufacturing and Assembly, Engineering Solutions, Reverse Engineering, Electronic Component Manufacturer

Description

GCI designs, develops, and manufactures form, fit, and function drop-in replacement electronics that can be seamlessly integrated into a larger electronics system as required. The replacement electronic components work identically to the original obsolete components. Commercial Off The Shelf (COTS) electronics fail to meet reliability requirements in certain demanding environments. GCI has the ability to repackage any die from a plastic package into a hermetic ceramic package as originally required. Hermetic packaging provides superior reliability to plastic packaging of integrated circuits (IC) and are able to meet full military standard qualification requirements.

Profile

  • Incorporated in
    Colorado
  • Established since
    2006
  • Main/Branch
    Branch

Address

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