Summary

Automated equipment, fluid dispensing, liquid dispensing, underfill, encapsulation, dam & fill, conductive epoxy, nonconductive epoxy, microvolume, solderpaste, soldermask, UV curable material, automated vision, non-contact

Industry

Description

Manufacturer of automated and semi-automated liquid/fluid dispensing equipment/pumps, primarily for consumer electronics, telecommunications, medical device, military, automotive and semiconductor packaging.

Profile

  • Incorporated in
    Colorado
  • Established since
    1985
  • Main/Branch
    Branch

Address

Contact