Summary

Wafer Processing, Wafer Dicing, Pick and Place, Dicing Wafers, Quick Turn, Wafer Grinding, Die Pick and Place, Backend Services, GaAs Wafer Process, Reticle Dicing, Quick Turn Process, Si Wafer Processing, Wafer Thinning, Die Inspection

Industry

Description

SawStreet provides backend services that include Grinding, Polishing, Dicing, Pick & Place, and Inspection. SawStreet handless low to mid volume, specializing in quick turn requirements. Additional services include managing IC packaging and bumping

Special details

SawStreet operates out of a class 100 clean room with automated equipment (ie. Dicing Saw, Pick and Place). Owners have been in working in the electronics business for a combined total of 40 years plus.

Profile

  • Incorporated in
    Florida
  • Established since
    2008
  • Main/Branch
    Branch

Address

Contact