Summary

Thick Film Mfg., PCB Ass'y.(SMT & TH), Electronic Modules, Chip & Wire Ass'y, Wire Bonding, Flip Chip & BGA Assy, Solder Die Attach, Epoxy Die Attach, RF Modules, Electromech. Assy's.

Industry

Description

Description

Florida MicroElectronics designs and manufactures electronic modules utilizing ceramic hybrid technologies and/or printed circuit board assemblies for customer's packaging solutions.

Special details

Thick Film process, Laser trimming, high speed SMT & Thru-hole assembly, vacuum reflow die attach assy, epoxy die attach, flip chip & BGA assys, wire & ribbon bonding, chip & wire assy, vacuum lamination, X-Ray analysis and electromechanical assemblies.

Profile

  • Incorporated in
  • Established since
    2005
  • Main/Branch
    Branch

Address

Contact