Summary

Electronic, Manufacturing, Services, SubContract, Semiconductor, Packaging, Manufacturer, Optoelectronic, Medical, Assembly, COB, Chipscale, Packages, Modules, Wirebond. Diebond, CircuitBoard, PCB, Component, Encapsulation, Multichip, Hybrid, LeadAttach, Studbumping, Micropost

Industry

Description

Microelectronic Packaging Precision Component Placement Die Attach Wire Bond-wedge and ball Circuit Board Design and Assembly Stud Bumping Encapsulation Hermetic Lid Sealing Lead Attach Package Design and Assembly

Special details

Wire bonding Pick and Place Die Bonding Encapsulation Assembly tools

Profile

  • Incorporated in
    Pennsylvania
  • Established since
    2000
  • Main/Branch
    Branch

Address

Contact